Best IC Design Software in New Zealand

Ansys Exalto is a post-LVS RLCk extraction software solution that enables IC designers to accurately capture unknown crosstalk among different blocks in the design hierarchy by extracting lumped-element parasitics and generating an accurate model for electrical, magnetic and substrate coupling. Exalto interfaces with most LVS tools and can complement the RC extraction tool of your choice. Ansys Exalto post-LVS RLCk extraction lets IC designers accurately predict electromagnetic and substrate coupling effects for signoff on circuits that were previously "too big to analyze.” The extracted models are back-annotated to the schematic or netlist, and support all circuit simulators. The proliferation of RF and high-speed circuits in modern silicon systems has raised electromagnetic coupling to a first order effect that must be accurately modeled to reliably achieve silicon success.

Deliver a faster time to market by reducing design complexity using high-quality DFT. Tessent silicon lifecycle management solutions include advanced debug, safety & security features, and in-life data analytics to meet the evolving challenges of today’s silicon lifecycle. Create an infrastructure that makes designs more testable. Silicon lifecycle management solutions achieve high-quality tests, identify defects and hidden yield limiters, and move beyond test into system debugging and validation. This ecosystem of tools effectively analyzes data to provide critical system insights that can then be used for in-life monitoring. Ensure the highest test quality, accelerate yield ramp, and improve safety, security, and reliability across the silicon lifecycle using best-in-class solutions for DFT, debug, and in-life monitoring plus powerful data analytics. Decrease time to yield, manage manufacturing excursions, and recover yield caused by systematic defects.

Sigrity X Advanced SI technology offers leading-edge signal integrity analysis for PCB and IC packaging designs, covering DC to over 56GHz with advanced features like automated die-to-die SI analysis, topology exploration, and simulation for high-speed interfaces. Supporting IBIS-AMI models and customizable compliance kits, it ensures your designs meet rigorous standards while leveraging frequency domain, time domain, and statistical analysis methods.

To ensure you get high performance at a system and component level, while at the same time saving between 15% and 50% in decoupling capacitor (decap) costs, Cadence® Sigrity X OptimizePI™ technology does a complete AC frequency analysis of boards and IC packages. Supporting both pre- and post-layout studies, it quickly pinpoints the best decap selections and placement locations to meet your power-delivery network (PDN) needs at the lowest possible cost. Sigrity X OptimizePI technology is built on proven Cadence hybrid electromagnetic circuit analysis technology in combination with the unique Sigrity optimization engine to help you quickly pinpoint the best possible decap selections and placement locations.

To help you tackle increasingly challenging issues related to simultaneous switching noise, signal coupling, and target voltage levels, Cadence® Sigrity X PowerSI® technology provides fast, accurate, and detailed electrical analysis of full IC packages or PCBs. It is cloud ready and can be used pre-layout to develop power- and signal-integrity guidelines, as well as post-layout to verify performance and improve a design without needing a prototype. Using Sigrity X PowerSI electromagnetic (EM) field solver technology, you can readily perform a broad range of studies to identify trace and via coupling issues, power/ground fluctuations caused by simultaneously switching outputs, and design regions that are under or over voltage targets. PowerSI technology also lets you perform extraction of frequency-dependent network parameter models and lets you visualize complex spatial relationships.