Sigrity X Platform Integrations

Sigrity X Aurora, integrated with all Allegro X Platforms, empowers designers to swiftly detect and correct signal and power integrity issues early, eliminating the need for expert inspections and ensuring projects stay on schedule and within budget. This seamless in-design analysis methodology supports comprehensive signal and power integrity analysis at every design stage, enabling precise "what if" scenario planning to set accurate constraints and minimize iterations. Unlock the future of signal and power integrity in PCB and IC design with an intuitive, easy-to-use platform. Step into the future with Sigrity X, where innovation meets optimization. Unlock the key to flawless signal and power integrity in your PCB and IC package designs, and leap far beyond the current limits of signal integrity (SI)/power integrity (PI) technology. Imagine effortlessly navigating the complexities of electronic design, and not just meeting, but shattering your time-to-market targets with precision

Sigrity X Advanced SI technology offers leading-edge signal integrity analysis for PCB and IC packaging designs, covering DC to over 56GHz with advanced features like automated die-to-die SI analysis, topology exploration, and simulation for high-speed interfaces. Supporting IBIS-AMI models and customizable compliance kits, it ensures your designs meet rigorous standards while leveraging frequency domain, time domain, and statistical analysis methods.

To ensure you get high performance at a system and component level, while at the same time saving between 15% and 50% in decoupling capacitor (decap) costs, Cadence® Sigrity X OptimizePI™ technology does a complete AC frequency analysis of boards and IC packages. Supporting both pre- and post-layout studies, it quickly pinpoints the best decap selections and placement locations to meet your power-delivery network (PDN) needs at the lowest possible cost. Sigrity X OptimizePI technology is built on proven Cadence hybrid electromagnetic circuit analysis technology in combination with the unique Sigrity optimization engine to help you quickly pinpoint the best possible decap selections and placement locations.

To ensure you achieve reliable power delivery, Cadence Celsius PowerDC technology provides efficient DC analysis for signoff of IC package and PCB designs, including electrical/thermal co-simulation, to maximize accuracy. Celsius PowerDC technology quickly pinpoints excessive IR drop, with areas of excess current density and thermal hotspots, to minimize your design’s risk of field failure. Highly accurate, even for complex designs with multiple voltage domains and complex plane structures, providing conclusive IR drop analysis for package and board. Automatically set up DC simulations using PowerTree Technology data (source/sink definitions) captured at the schematic stage of the design process. Comprehensive support for multi-structure designs, including stacked die, multiple boards, and all popular package types.

To help you tackle increasingly challenging issues related to simultaneous switching noise, signal coupling, and target voltage levels, Cadence® Sigrity X PowerSI® technology provides fast, accurate, and detailed electrical analysis of full IC packages or PCBs. It is cloud ready and can be used pre-layout to develop power- and signal-integrity guidelines, as well as post-layout to verify performance and improve a design without needing a prototype. Using Sigrity X PowerSI electromagnetic (EM) field solver technology, you can readily perform a broad range of studies to identify trace and via coupling issues, power/ground fluctuations caused by simultaneously switching outputs, and design regions that are under or over voltage targets. PowerSI technology also lets you perform extraction of frequency-dependent network parameter models and lets you visualize complex spatial relationships.