Orbital Stack
Orbital Stack is an AI and CFD web-based software that provides earlier qualitative guidance, comparing a large number of design options while highlighting any potential wind and thermal comfort red flags. It allows for the realization of a variety of climate-conscious, high-performance developments not previously feasible due to cost and/or time constraints associated with traditional studies.
Orbital Stack is the first digital climate-analysis tool built by global leaders in wind and microclimate engineering using real wind tunnel data. It is truly a game-changer for the architecture and building design sector, offering our clients direct access to wind comfort and safety analysis, thermal comfort and shadowing analysis, and cladding pressure simulations. This means architects can run their own wind simulations and quickly understand the climate impacts of their proposed building designs from the start, making decisions that result in higher performing and more resilient projects.
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GASP
GASP is a structured/unstructured, multi-block CFD flow solver which solves the Reynolds Averaged Navier-Stokes (RANS) equations as well as the heat conduction equation for solid bodies. Hierarchical-tree based organization. Pre- and post-processing in one interface. Solves steady and unsteady 3-D, Reynolds-Averaged, Navier-Stokes Equations (RANS) and subsets. Multi-block structured/unstructured grid topology. Unstructured mesh support for tetrahdra, hexahedra, prisms, and pyramids. Integration with portable extensible toolkit for scientific computation library. Uncoupling of systems including turbulence and chemistry for improved computational efficiency. Support for most parallel computers, including clusters. Integrated domain decomposition is transparent to the user.
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Ansys Sherlock
Ansys Sherlock is the only reliability physics-based electronics design tool that provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early stage design. Ansys Sherlock automated design analysis provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages. Sherlock bypasses the ‘test-fail-fix-repeat’ cycle by empowering designers to accurately model silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs) and assemblies to predict failure risks due to thermal, mechanical and manufacturing stressors--all before prototype. With embedded libraries containing over 500,000 parts, Sherlock rapidly converts electronic computer-aided design (ECAD) files into computational fluid dynamics (CFD) and finite element analysis (FEA) models. Each model contains accurate geometries, material properties and translates stress information.
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Ansys Electronics Desktop (AEDT)
The use of Ansys Electronics solution suite minimizes testing costs, ensures regulatory compliance, improves reliability, and drastically reduces your product development time. All this while helping you build the best-in-class and cutting-edge products. Leverage the simulation capability from Ansys to solve the most critical aspects of your designs. With our solutions, we help you solve the most critical aspects of your product designs through simulation. If you work with antenna, RF, microwave, PCB, package, IC design, or even an electromechanical device, we provide you with the industry gold standard simulators. These solutions help you solve any electromagnetic, temperature, SI, PI, parasitic, cabling, and vibration challenges in your designs. We build on this with complete product simulation, allowing you to achieve first-pass success designing an airplane, car, cellphone, laptop, wireless charger, or any other system.
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