QUINDOS
With different analysis packages available it is possible to measure anything from machined parts to gears, blades, screw compressors, camshafts and more on a wide range of CMMs. QUINDOS is the leading modular metrology software for complex geometries used in aerospace, energy, automotive, and engineering. Choose from a wide range of modules to build precise measurement applications. Design your application and customise the UI for your machine operators. Highly programmable for the most complex geometries, QUINDOS offers structured programming and the option to build a custom command library with UI support. Find out how Siemens AG Turbines use QUINDOS and I++ Simulator high-pressure blades to fully visualise production and measurement in a single step. See how BMT Aerospace uses QUINDOS and I++ Simulator to streamline production with a virtual measuring room for offline testing
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Altair SimSolid
By performing structural analyses on fully featured CAD assemblies within minutes, SimSolid is the game-changing simulation technology for designers, engineers, and analysts. It eliminates geometry preparation and meshing: the two most time-consuming, expertise-extensive and error-prone tasks performed in a conventional structural simulation.
Multiple design scenarios can be simulated quickly under real-life conditions. Early CAD models, in any common format, can be used. SimSolid tolerance of imprecise geometry means that, unlike CAD-embedded simulation tools, there is no need to simplify complex geometries before analyzing designs.
SimSolid supports all typical connections (bolt/nut, bonded, welds, rivets, sliding) and analysis of linear static, modal, thermal properties, along with more complex coupled, nonlinear, transient dynamic effects.
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Ansys Icepak
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics. Ansys Icepak provides powerful electronic cooling solutions that utilize the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI). Perform conduction, convection, and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Ansys’ complete PCB design solution enables you to simulate PCBs, ICs, and packages and accurately evaluate an entire system.
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PowerFLOW
By leveraging our unique, inherently transient Lattice Boltzmann-based physics PowerFLOW CFD solution performs simulations that accurately predict real world conditions. Using the PowerFLOW suite, engineers evaluate product performance early in the design process prior to any prototype being built — when the impact of change is most significant for design and budgets. PowerFLOW imports fully complex model geometry and accurately and efficiently performs aerodynamic, aeroacoustic and thermal management simulations. Automated domain discretization and turbulence modeling with wall treatment eliminates the need for manual volume meshing and boundary layer meshing. Confidently run PowerFLOW simulations using large number of compute cores on common High Performance Computing (HPC) platforms.
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