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About

Foundry-certified, the AFS Platform delivers nm SPICE accuracy, 5x faster than traditional SPICE and >2x faster than parallel SPICE simulators. Offering the fastest nm circuit verification platform for analog, RF, mixed-signal, and custom digital circuits. Now includes new eXTreme technology. For large post-layout circuits, the new AFS eXTreme technology delivers over 100M-element capacity and is 3x faster than post-layout simulators. Supports all leading digital solvers. Best-in-class usability, allowing maximum reuse of verification infrastructure. Advanced verification and debug capabilities to improve verification coverage. Improved design quality, and time-to-market. SPICE accurate, high-sigma verification. 1000x faster than brute-force simulation. Easy to use, and deploy. AFS eXTreme technology is available at no additional cost.

About

Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature, and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics. Ansys Icepak provides powerful electronic cooling solutions that utilize the industry-leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs), and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI). Perform conduction, convection, and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. Ansys’ complete PCB design solution enables you to simulate PCBs, ICs, and packages and accurately evaluate an entire system.

Platforms Supported

Windows
Mac
Linux
Cloud
On-Premises
iPhone
iPad
Android
Chromebook

Platforms Supported

Windows
Mac
Linux
Cloud
On-Premises
iPhone
iPad
Android
Chromebook

Audience

Teams requiring a solution providing circuit simulation tools to improve their design processes

Audience

Engineers looking for a cooling simulation software for their electronic components

Support

Phone Support
24/7 Live Support
Online

Support

Phone Support
24/7 Live Support
Online

API

Offers API

API

Offers API

Screenshots and Videos

Screenshots and Videos

Pricing

No information available.
Free Version
Free Trial

Pricing

No information available.
Free Version
Free Trial

Reviews/Ratings

Overall 0.0 / 5
ease 0.0 / 5
features 0.0 / 5
design 0.0 / 5
support 0.0 / 5

This software hasn't been reviewed yet. Be the first to provide a review:

Review this Software

Reviews/Ratings

Overall 0.0 / 5
ease 0.0 / 5
features 0.0 / 5
design 0.0 / 5
support 0.0 / 5

This software hasn't been reviewed yet. Be the first to provide a review:

Review this Software

Training

Documentation
Webinars
Live Online
In Person

Training

Documentation
Webinars
Live Online
In Person

Company Information

Siemens
Founded: 1847
United States
eda.sw.siemens.com/en-US/ic/analog-fastspice/

Company Information

Ansys
United States
www.ansys.com/products/electronics/ansys-icepak

Alternatives

Alternatives

OrCAD X

OrCAD X

Cadence Design Systems
Energy2D

Energy2D

The Concord Consortium
PathWave RFIC Design

PathWave RFIC Design

Keysight Technologies
TAITherm

TAITherm

ThermoAnalytics
RFPro Circuit

RFPro Circuit

Keysight

Categories

Categories

Integrations

Ansys Electronics Desktop (AEDT)
Ansys Fluent

Integrations

Ansys Electronics Desktop (AEDT)
Ansys Fluent
Claim Analog FastSPICE Platform and update features and information
Claim Analog FastSPICE Platform and update features and information
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